Electronics
Debron Industrial Electronics offers a "Best in Class" printed circuit
manufacturing facility providing a vast array of value added services
from assembly of small, simple thru-hole to extremely complex
16" x 18" mixed technology printed circuit assemblies. With circuit
board layout and design for manufacturability capability and modern
assembly processes, we provide our customers with a total
manufacturing solution for their printed circuit assembly needs.
The capabilities at Debron cover a wide range of axial, radial,
odd form components, surface mount devices and leading edge
technology Ball Grid Array (BGA) placements. We routinely process
Class I, II, and III single and double-sided configurations with standard
or fine pitch requirements on various printed circuit board substrates
(i.e., FR-4 rigid and flex, polyamide flex...).
Electronic assembly is based on an environmental friendly process utilizing
VOC free no clean fluxes for both reflow and wave solder operations.
Surface Mount Device Capability
Component size from 0402's through a maximum package size of 2" x 2"
Fine pitch placement to 12 mil and BGA's, up to 1156 ball with 100%
solder paste and BGA vision inspection
Surface Mount Device Assembly
In-line stencil printers, w/2D post-print vision inspection
2 fully automated, high speed placement lines
100% forced air convection reflow ovens
Thru-hole Assembly
High Speed Axial Insertion & Semi-Automatic Odd Form Thru-hole Assembly Equipment
Large format Wave Solder (convection heat & dual-wave)
Process Support Equipment
Machine Programming Software (CAM) for conversion of customer supplied design data
In-line CCD camera inspection stations
Vision assisted BGA & Fine Pitch Workstations
X-Ray inspection available
